This instrument uses a resistive heating component to impart high temperatures to different source materials, causing them to reach melting point and create a vapor which is later condensed into a given substrate. This method is called “physical vapor deposition” and consists in the placement of films of pure compounds in different substrates. The deposition is done through the application of vacuum, by means of a mechanical and sub-molecular pump. Our thermal evaporator deposits layers with thickness in the range of Angstrom to microns, and can only do one source material per run. It reaches pressures up to 10-6 torr and it is mostly used for source materials like gold and platinum.
Principal Custodian: Ubaldo M Cordova Figueroa